Measurement-computing USB-TC-AI Instrukcja Użytkownika Pobierz pdf (Strona 19)

USB-TC-AI User's Guide Specifications

Analog input calibration

Table 9. Analog input calibration specifications

Parameter

Specification

Recommended warm-up time

30 minutes min

Calibration

Firmware calibration

Calibration interval

1 year

Calibration reference

+10.000 V, ±5 mV max. Actual measured values stored in EEPROM

Tempco: 5 ppm/°C max

Long term stability: 30 ppm/1000 h

Throughput rate

Table 10. Throughput rate specifications

Number of Input Channels

Maximum throughput

2 S/s

2 S/s on each channel, 4 S/s total

2 S/s on each channel, 6 S/s total

2 S/s on each channel, 8 S/s total

2 S/s on each channel, 10 S/s total

2 S/s on each channel, 12 S/s total

2 S/s on each channel, 14 S/s total

2 S/s on each channel, 16 S/s total

Note 11: The analog inputs are configured to run continuously. Each channel is sampled twice per second.

The maximum latency between when a sample is acquired and the voltage/temperature data is

provided by the USB unit is approximately 0.4 seconds.

Digital I/O

Table 11. Digital input/output specifications

Parameter

Specification

Digital type

5V CMOS

Number of I/O

8 (DIO0 through DIO7)

Configuration

Independently configured for input or output.

Power on reset is input mode.

Pull-up/pull-down

configuration

All pins pulled up to +5 V via 47 K resistors (default). Contact MCC factory for pull-

down to ground (GND) capability.

Digital I/O transfer rate

(software paced)

 Digital input: 50 port reads or single bit reads per second typ

 Digital output: 100 port writes or single bit writes per second typ

Input high voltage

2.0 V min, 5.5 V absolute max.

Input low voltage

0.8 V max, –0.5 V absolute min

Output low voltage

(IOL = 2.5 mA max)

0.7 V max

Output high voltage

(IOH = -2.5 mA max)

3.8 V min

Note 12: All ground pins on the USB-TC-AI (pins 9, 19, 22, 27, 30, 33, 36, 39, 49) are common and are

isolated from earth ground. If a connection is made to earth ground when using digital I/O and

conductive thermocouples, the thermocouples are no longer isolated. In this case, thermocouples must

not be connected to any conductive surfaces that may be referenced to earth ground.

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